MAY 19-20, 2025

Old Town, Virginia

CONFERENCE
OVERVIEW

iiBIG’s 16th Annual Education Finance & Loan Symposium, will take place on May 19-20, 2025 in the Washington DC area. (Final venue arrangements are being made to host our 2025 event in Old Town, Virginia and will be announced soon!)

This event has become known as the only conference of its’ kind to attract a 360-degree cross-section of all the key players in the education finance/student loan industry.

This year’s conference will feature NEW SESSIONS on Investment and M&A Opportunities in the Higher Education Products & Services Vendor Sector.

OVERVIEW
& FACULTY

This year’s symposium will feature more than 30 distinguished speakers from the higher education finance and student loan sectors. It will focus on emerging trends and opportunities, and new sessions will explore Investment and M&A opportunities in the Higher Education market for Edtech, Fintech and other solution providers seeking growth in this sector.

FEATURED
TOPICS

Interactive, roundtable presentations and discussions will focus on timely information on topics including:

Keynote Panel: Examining the future of Higher Education Finance and Student Loans in the new Presidential administration.
Investment & M&A Opportunities in Higher Education: Insights into opportunities for Fintech, Edtech and other solution providers seeking greater market share in this sector.
Private Lenders Roundtable: The evolving role of private lenders in student loan origination.
Servicing & Collections: Strategies for managing student loans across different sectors.
Financial Aid Leaders Update Perspectives from leaders in for-profit and non-profit education.
Capital Markets Trends: Forecasting changes in the secondary markets for student loans.
Regulatory Outlook: Legal considerations for student loans in the future.
Innovative Repayment Plans: New developments in loan repayment strategies.
Federal Loan Forgiveness: Predictions for loan forgiveness efforts in 2025

To apply to participate as a member of the executive faculty to address these topics or to submit suggestions, please visit our JOIN OUR FACULTY page or contact the conference organizer: Don Buford at DonB@iiBIG.com.

WHO WILL
ATTEND

Attendance at our in-person events has averaged between 125-150 and, early indications are that this year’s IN-PERSON conference will continue this trend.

Representatives from higher education (including US- and International for-profit and non-profit colleges and universities), investors, banks, credit unions, online marketplace and other alternative lenders, loan servicers, ratings agencies, regulators, attorneys and more will join us again in 2025. More specifically attendees will include:
–

U.S. Department of Education Regulators & Policy-Makers
Congressional Higher Education Policy-Leaders from the US House & Senate
CFPB Regulators
Private Student Loan Lenders and Credit Unions
Federal & Private Student Loan Servicers
Cloud-based Marketplace Fintechs & Student Loan Aggregator Platforms
Higher Education Financial Aid Leaders
Capital Market Specialists
Asset-based Secondary Market Leaders

Higher Education Vendors, Service Providers & Entrepreneurs
Private Equity Investors & M&A Advisors
Legal Advisors
Investment Banking & Transaction Consultancies
Higher Education Financial Aid Officers
Portfolio Managers
Credit Union Student Loan Officers
Rating Agencies
Credit Analysts
Corporate Finance Professionals
Student Loan Consultancies

REGISTRATION & RATES:

STANDARD RATE*

(per person)

$1695

This rate applies to for-profit and non-profit lenders, investment banks, credit unions, investment consultants, law firms, private equity, Higher Ed vendors & entrepreneurs, ratings agencies, accounting firms, and other financial service providers.

GOV. & ACADEMIC RATE**

(per person)

$895

This rate applies to executives from Federal and State Governments and Representatives of Public & Private Academic Institutions ONLY.
Registration in this category is subject to review and final approval.

GROUP RATES

(Groups of 3 or More)

SAVE MORE!

Discounted rates are available for Groups of 3 or More. For more information, contact:
Hank Woji, SVP, Business Development, iiBIG
Phone: 713-806-0354 | Email: HankW@iiBIG.com

SPEAKING FACULTY OPPORTUNITIES:

Applications are now being reviewed from executives who wish to contribute as members of our Executive Speaking Faculty. If you have extensive knowledge of education finance/student loans and would like to apply for a position on our executive speaking faculty please complete our online JOIN OUR FACULTY APPLICATION. Or contact:

Don Buford, Conference Organizer,
Founder & CEO, iiBIG
Phone: 212-300-2521
Email: DonB@iibig.com

BUSINESS DEVELOPMENT:

Conference sponsorship provides an opportunity for companies seeking increased brand awareness and a platform to demonstrate expertise, products, or services. If confirmed early, conference sponsorship may include the opportunity to be represented on the executive speaking faculty. For more information, contact:

Hank Woji,
SVP, Business Development, iiBIG
Phone: 713-806-0354
Email: HankW@iiBIG.com

MARKETING OPPORTUNITIES:

Co-branding/marketing opportunities are available for publications, digital and print newsletters, professional associations, or other organizations that provide news and information to the higher education finance/student loan industry. For more information on these opportunities, please contact:

Juliana Araujo,
President, iiBIG LLC
Phone: 703-716-3816
Email: JulianaA@iiBIG.com

CONTINUING EDUCATION CREDITS

Continuing Education Credits (e.g. CLE, CPE, CME, etc.) may be available for iiBIG conference attendees. Upon request conference attendees will be provided with a “Certificate of Attendance” and a copy of the conference agenda, showing topics, length of sessions, and name(s) and professional affiliation(s) of presenter(s) for each session. Attendees wishing to apply for continuing education credits for attending this conference may submit this documentation to the relevant organization in his/her state when applying for such credits.